| MRC | Criteria | Characteristic |
|---|
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | ESTABLISHED |
| AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.010 |
| ABJT | TERMINAL LENGTH | 0.005 INCHES MINIMUM AND 0.020 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.055 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.055 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.057 INCHES MAXIMUM |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBQ | CAPACITANCE VALUE PER SECTION | 12.000 PICOFARADS SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -5.00/+5.00 PICOFARADS SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC OR GLASS |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.050 |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | ESTABLISHED |
| AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.010 |
| ABJT | TERMINAL LENGTH | 0.005 INCHES MINIMUM AND 0.020 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.055 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.055 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.057 INCHES MAXIMUM |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBQ | CAPACITANCE VALUE PER SECTION | 12.000 PICOFARADS SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -5.00/+5.00 PICOFARADS SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC OR GLASS |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.050 |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | ESTABLISHED |
| AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.010 |
| ABJT | TERMINAL LENGTH | 0.005 INCHES MINIMUM AND 0.020 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.055 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.055 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.057 INCHES MAXIMUM |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBQ | CAPACITANCE VALUE PER SECTION | 12.000 PICOFARADS SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -5.00/+5.00 PICOFARADS SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC OR GLASS |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.050 |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | ESTABLISHED |
| AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.010 |
| ABJT | TERMINAL LENGTH | 0.005 INCHES MINIMUM AND 0.020 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.055 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.055 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.057 INCHES MAXIMUM |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBQ | CAPACITANCE VALUE PER SECTION | 12.000 PICOFARADS SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -5.00/+5.00 PICOFARADS SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC OR GLASS |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.050 |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |